G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced n/n+[n++]) by microwave photoconductive decay

n/n+[n++]) by microwave photoconductive decay method using short wavelength excitation light source (the short wavelength excitation µ-PCD method)

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mold manufacturers

This Specification covers the substrate requirements for monocrystalline high-purity indium phosphide wafers used in semiconductor and electronic device manufacturing

G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced n/n+[n++]) by microwave photoconductive decayThis specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.