G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive 1 GEM is intended to

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SEMI D25 ¾ Specification for Flat Panel Display Substrate Shipping Case

G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive 1 GEM is intended toNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line tool makers as the