MX1 X-Ray Inspection System ULTIMA NEO-L The dual-vision system combines Cognex®

The dual-vision system combines Cognex® on-the-fly alignment with a stationary upward-looking camera to accurately place BGAs

Handles PCB widths: 50–460 mm

uniform PCB cooling after reflow

with programmable speeds from 400–1800 mm/min (16"–71")

MX1 X-Ray Inspection System ULTIMA NEO-L The dual-vision system combines Cognex®Difference In Magnification These images compare a standard 80 kV x ray tube (35 m focal spot, left) with an upgraded 10 m focal spot system (right), showing significantly higher detail and magnification up to 225X. MX1 X Ray Inspection Exposes Hidden BGA Flaws The MX1 detects hidden BGA defects including missing balls, misalignment, bridging, and internal voids.